‡Present address: Starry, Boston, Massachusetts, 02111, USA.Summa 元214 Laser Cutter, L Series Laser Cutting SystemĬommercial, apparel and industrial textiles are some of the fastest growing markets in the global economy, where on-demand and fast delivery becomes increasingly important.†Present address: Northrop Grumman, Linthicum Heights, Maryland, 21090, USA.6McClellan Nuclear Research Center-University of California, Davis, McClellan, California 95652, USA.5Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, Maryland 21218, USA.4Department of Physics, United States Naval Academy, Annapolis, Maryland 21402, USA.3Institute for Quantum Matter, Department of Physics and Astronomy, Johns Hopkins University, Baltimore, Maryland 21218, USA.2Department of Chemistry, Johns Hopkins University, Baltimore, Maryland 21218, USA.1Johns Hopkins University Applied Physics Laboratory, Laurel, Maryland 20723, USA.Abraham 1,*, Cameron Gutgsell 1, Dalibor Todorovski 1, Scott Sperling 1,†, Jacob E. This work demonstrates that the silicon vacancy in silicon carbide provides a low-cost and simple approach to quantum sensing of magnetic fields. This is accomplished without utilizing complex photonic engineering, control protocols, or applying excitation powers greater than a watt. By coarsely optimizing the anneal parameters and minimizing power broadening, we achieve a sensitivity of 50 nT / Hz and a theoretical shot-noise-limited sensitivity of 3.5 nT / Hz. We report the realization of nanotesla shot-noise-limited ensemble magnetometry based on optically detected magnetic resonance with the silicon vacancy in 4 H silicon carbide. The negatively charged silicon vacancy is one of the leading spin defects studied in silicon carbide owing to its near-telecom photoemission, high spin number, and nearly temperature-independent ground-state zero-field splitting. Silicon carbide is a promising host material for spin-defect-based quantum sensors owing to its commercial availability and established techniques for electrical and optical microfabricated device integration.
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